球化温度对BGA钎焊球真球度及表面质量的影响
Influence of Spheroidization Temperature on Real Sphericity and Surface Quality of BGA Solder Ball
黄丽梅1， 王国欣2， 郭晓晓1， 张宗伟1， 闫焉服1
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作者单位：1. 河南省有色金属材料科学与加工技术重点实验室，河南 洛阳 471003； 2. 河南科技大学 车辆与动力学院，河南 洛阳 471003
中文关键字：钎焊球；真球度；外观质量；球化温度
英文关键字：solder ball； real sphericity； appearance quality； spheroidization temperature
中文摘要：钎焊球是BGA及μBGA等高密封装技术中凸点制作的关键材料，球化温度是影响钎焊球质量的关键因素之一。本文采用自制切丝重熔法装置，以花生油为球化剂，研究了球化温度对63Sn37Pb钎焊球真球度和表面质量的影响。结果表明：在其他条件相同情况下，随着球化温度升高，钎焊球球化效果及表面质量越好，但球化温度过高（超过300 ℃），球化剂易产生浓烟，钎焊球易氧化。实验条件下，球化温度以300 ℃为宜。
英文摘要：Solder ball is the important material of high hencapsulate technology such as BGA(Ball Grid Array) and μBGA, and the spheroidization temperature is one of important factors of the surface quality. The influence of spheroidization temperature on real sphericity and surface quality was studied, using peanut oil as the nodulizer. The results show that the real sphericity and surface quality of the solder ball are better under the higher spheroidization temperature. However, when the spheroidization temperature is too high, the nodulizer emits the smother and the solder balls are oxidized easily. So the spheroidization temperature should be 300 ℃ under the condition of the experiment.