真空电子器件用V-B系列钎料研究
Research on A Series of V-B Solder Used in Vacuum Electronic Devices
姜 婷， 李银娥， 马 光， 郑 晶
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作者单位：西北有色金属研究院，陕西 西安 710016
中文关键字：钨钼钎焊；钎焊料；熔点；铺展性
英文关键字：brazing of tungsten-molybdenum； solder； melting point； spreadability
中文摘要：采用真空-充氩熔炼V-B系列钎料，并通过球磨技术制成焊料粉末。实验表明：V-B系列钎料的真空钎焊性能优良；V-B系列块状钎料瞬间熔化并快速铺开，流动性好，润湿性好，表面均匀。V-B-Pd块状钎料的熔点为1730 ℃，V-B块状钎料的熔点为1740 ℃；V-B粉末钎料铺展均匀，有明显的润湿环，钎料铺展面积约占基体面积的3/4，钎料的熔点为1560 ℃。
英文摘要：A series of V-B solder were melted by vacuum-filling argon and solder powder was made by ball milling technology. The results show that the solderability of series of V-B solder is excellent， massive series of V-B solder are instantly melted and quickly spreaded, the fluidity and wettability is good， the surface is uniform. The melting point of V-B-Pd solder is 1730℃, the melting point of V-B solder is 1740 ℃. The powder of V-B solders is spreaded uniformly, it has significant wetting ring, the spreading area is 3/4 of matrix area, the melting point is 1560 ℃.