基体负偏压对TiAlN/TiN膜层组织成分及硬度的影响
Effects of Pushed Bias on Microstructure and Hardness of TiAlN/TiN Coating
卢 龙1, 蒋 涛2, 严 铿2
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作者单位：1. 淮海工学院 机械工程学院, 江苏 连云港 222005; 2. 江苏科技大学 材料学院, 江苏 镇江 212003
中文关键字：多弧离子镀； TiAlN； TiN
英文关键字：multi-arc ion plating; TiAlN; TiN
中文摘要：采用多弧离子镀技术在40Cr基体上制备TiAlN/TiN复合膜层；利用金相显微镜、扫描电子显微镜和显微硬度仪研究基体负偏压对膜层硬度的影响。结果表明：基体负偏压对膜层性能有显著影响，过高或过低的基体偏压会使得膜层表面不平整，表面显微硬度降低。基体负偏压越高，膜层中Ti、Al原子的含量就越低。
英文摘要：40Cr steel substrate was coated with TiAlN/TiN films by multi-arc ion technology. The effects of pushed bias on microstructure and hardness of TiAlN/TiN coating were studied with metallographic microscope, SEM and microhardness instrument. The results show that the pushed bias has a great influence on performance of TiAlN/TiN films. The excessive high pushed bias can make the surface of films out of flatness and reduce the hardness of films. The content of Ti and Al in films becomes lower if the pushed bias becomes more higher.