Sn-Zn-Al-P系无铅焊料物理性能研究
Study on Physical Properties of Sn-Zn-Al-P Lead-free Solder
皮苗苗， 张修庆， 张海娟， 赵祖欣， 叶以富
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作者单位：华东理工大学 机械与动力工程学院 承压系统安全科学教育部重点实验室，上海 200237
中文关键字：无铅焊料；熔点；导电性能；润湿性
英文关键字：lead-free solder; melting point; conductive property; wetting ability
中文摘要：在Sn-Zn系无铅焊料的基础上，通过添加合金元素Al和P制备出不同成分的无铅焊料，研究了其无铅焊料的物理性能。结果表明：通过加入适量合金元素Al和P的Sn-Zn-Al-P系无铅焊料在基本上不影焊料响熔点的前提下，可以减小密度，降低成本，提高其导电性能和润湿性。
英文摘要：The different weight percentages of Sn-Zn-Al-P lead-free solders were processed by adding alloying elements Al and P. The physical properties of Sn-Zn-Al-P lead-free solders were researched. The results show that appropriate amount of alloying elements Al and P of Sn-Zn-Al-P lead-free solders can reduce the density to cut the costs and improve conductive property and wetting ability without the effect of melting point of Sn-Zn-Al-P lead-free solders.