改善无铅焊锡粉末质量方法的研究
Study on Method to Improve Quality of Lead-free Solder Powder
许天旱， 王党会， 姚婷珍
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作者单位：（西安石油大学 材料科学与工程学院，陕西 西安 710065）
中文关键字：SnAgCu系无铅焊锡粉末； 熔化室气氛； 保温时间； 有效雾化率； 粉末特性
英文关键字：lead-free solder powder of Sn-Ag-Cu system; melt chamber gas; holding temperature time; efficient atomization efficiency; powder properties
中文摘要：利用自制的超音速雾化制粉装置，探索了无铅焊锡粉末制备过程中影响粉末质量的因素，并提出解决问题的方法。结果表明：改变熔化室气氛和减少保温时间均能显著提高无铅焊锡雾化粉末的质量；在提高有效雾化率和降低氧含量方面，改变熔化室气氛比减少保温时间效果更显著，且同时改变熔化室气氛和减少保温时间超过其单独作用的效果；通过同时改变熔化室气氛和减少保温时间，能够明显改善雾化粉末的粒度分布、球形度和表面光滑度。
英文摘要： The factors which affected powder quality in the process of lead-free solder powder preparation were explored by supersonic atomization designed by ourselves, and some measures which can resolve the quality problems were found. The results show that it can significantly improve powder quality through changing melt chamber gas and reducing holding time; changing the melt chamber gas possesses has more significant effectiveness than reducing holding time for improving the efficient atomization efficiency of powder and decreasing the oxygen content of powder; the effectiveness of changing both melt chamber gas and holding time is better than either of their effectiveness, it can notably improve surface smoothness of powder through changing both the melt chamber gas and the holding time.