无铅焊锡粉末雾化过程中存在的问题及解决方法
Problem and Solution in Process of Lead-free Solder Powder Atomizing
许天旱， 王党会， 姚婷珍
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作者单位：西安石油大学 材料科学与工程学院，陕西 西安 710065
中文关键字：SnAgCu系无铅焊锡粉末； 有效雾化率； 雾化合金量； 粘结现象； 雾化装置改造
英文关键字：lead-free solder powder of SnAgCu system; efficient atomization efficiency; atomizing alloy mass; binding phenomenon; atomization equipment modifying
中文摘要：利用自行设计的超音速雾化制粉装置，探索了无铅焊锡粉末雾化过程中存在的问题，并提出解决方法。结果表明：随着雾化合金量的增加，粉末有效雾化率急剧下降；通过改造设备，发现雾化合金量为5 kg时，水平喷气法提高粉末有效雾化率效果最好，有效雾化率达到74% ，且粘结现象明显减少，片状粉末增加不显著；综合增加高度法、水平喷气法和添加不锈钢衬垫法，有效雾化率为78% ，且雾化粉末具有良好的综合性能。
英文摘要：The problems which were found in lead-free solder powder atomizing process were explored with supersonic atomization designed by ourselves, and the measures were put forward to resolve the problem. The results show that the powder efficient atomization efficiency rapidly reduces with the increase of the alloy mass; through modifying equipment, it is found that level spraying gas method is optimal in all methods, its efficient atomization efficiency is 74% when atomizing alloy mass is 5 kg, and binding phenomenon significantly reduces, the flake powder does not increases obviously; the efficient atomization efficiency of the synthetical method including adding height, level spraying gas, stainless steel laying is 78%, and the atomizing powder has better combination property.