钎焊温度对AA4045/AA3003复合层焊缝组织及性能的影响
Effect of Soldering Temperature on Microstructure and Properties of AA4045/AA3003 Composite Layer Soldering Seam
刘怀玉, 凌泽民, 单庆成
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作者单位:重庆大学 材料科学与工程学院,重庆 400030
中文关键字:钎焊; 显微组织; 未焊透; 溶蚀
英文关键字:brazing; microstructure; incomplete penetration; dissolution
中文摘要:为了获得组织性能良好的钎缝,通过改变钎焊温度,对 AA4045/AA3003 铝合金复合板材料进行炉中气氛保护钎焊。通过焊缝显微组织分析, 以及焊件水压检漏测试、 氦气检漏测试和盐雾腐蚀试验, 分析钎焊温度对接头组织性能的影响。结果表明, 在网带速率为800 mm/min的条件下,设定钎焊温度为610~615℃, 实际钎焊温度为608~612 ℃时, 钎焊焊缝组织性能良好;钎焊温度低于608 ℃时,焊缝有未焊透现象,工件漏气现象明显; 钎焊温度高于612 ℃时, 由于温度过高,促使元素扩散和铝合金的溶解加剧, 导致接头区域有溶蚀发生,并且随温度的升高,溶蚀现象趋于严重。
英文摘要: In order to obtain good solder joints in structure and performance, different soldering temperature was adopted to solder the aluminum alloy composite plate of AA4045/AA3003 materials in an atmosphere protection furnace. The microstructure analysis via optical microscope, pressure leak testing, helium leak testing and salt fog corrosion testing was carried out, and then the effect law of soldering temperature on the microstructure and properties of the soldering seam was analyzed. The experimental results show that with the net rate of 800 mm/min, the microstructure of soldering seam is good under the conditions of setting soldering temperature 610~615℃ and actual soldering temperature 608~612℃; when the soldering temperature is lower than 608 ℃, there is incomplete penetration to the seam and apparent leakage to the workpieces when the soldering temperature is higher than 612 ℃, the diffusion of elemect and dissolution of aluminum alloy is prometed, leading to erosion occurs in the seam region, and with the temperature increasing, the solution phenomenon tends to be serious.