碘化钾对铝合金表面化学镀镍的影响
Effect of KI on Electroless Ni-P Coating for Aluminum Alloy
梁 平
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作者单位：辽宁石油化工大学 机械工程学院, 辽宁 抚顺 113001
中文关键字：铝合金； 化学镀； 碘化钾； 显微硬度； 耐蚀性
英文关键字：Al alloy; electroless plating; KI; micro-hardness; corrosion resistance
中文摘要：研究了碘化钾(KI)对LC4铝合金表面化学镀Ni-P合金层沉积速度的影响，采用金相显微镜、显微硬度计和交流阻抗等方法考察了碘化钾对Ni-P镀层形貌、显微硬度以及耐蚀性的影响。结果表明：KI使Ni-P合金镀层的沉积速度有所降低， 使镀层表面缺陷数量减少， 镀层致密性提高。 随着镀液中KI含量的增加，镀层显微硬度逐渐降低，但都高于镀液中无KI时所得镀层的硬度。此外，KI也改善了镀层在w(NaCl)= 3.5%溶液中的耐蚀性。镀液中KI的适宜含量为10～20 mg/L。
英文摘要：The effect of KI on the deposition velocity of Ni-P electroless plating coating for LC4 aluminium alloy was investigated, and the surface micrograph was observed using OM, and the surface micro-hardness and corrosion resistance of Ni-P coating were tested by micro-vicker and electrochemical impedance spectroscopy (EIS), respectively. The results show that KI decreases the deposition velocity and defects of Ni-P films, and the Ni-P surface morphology gets more homogenous, which contributes to higher micro-hardness and better corrosion resistance in 3.5wt%NaCl solution. The reasonable concentration of KI in the bath is 10～20 mg/L.