一种新型铜基电触头材料退火行为的研究
Study on Annealing Behavior of New Type Copper-based Electrical Contact Material
张晓燕1,2, 朱礼兵1, 李家锐1, 孙 涛1
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作者单位：(1. 贵州大学 材料与冶金学院, 贵州 贵阳 550003; 2.贵州省材料结构与强度重点实验室, 贵州 贵阳 550003
中文关键字：铜基电触头材料； 退火； 显微硬度； 电接触性能
英文关键字：copper-based electrical contact materials; annealing; microhardness; electrical contact performance
中文摘要：对一种新型铜基电触头材料的退火行为进行了研究。结果表明，合金经1050 ℃× 20 h退火处理，组织发生明显变化，粗大的枝晶明显消除，晶粒变得细小，合金显微硬度下降至139.7 HV，有利于触头的加工成型；基体相为Cu-Ni相，第二相为Ni-Ti相；合金的接触电阻相对较小，电气寿命升高，具有良好的电接触性能。
英文摘要：The annealing behavior of a new type of copper-based electrical contact materials was studied. The results show the microstructure of materials annealed at 1050 ℃ for 20 h has significant changes, the large dendrite eliminates apparently, the grain become smaller, the microhardness decreases to 139.7 HV, which is benefit for processing. The matrix phase is Cu-Ni phase and the second phase is Ni-Ti phase. The contact resistance is relatively smaller and electrical life increases, it has good electrical contact performances.