Bi对Sn-0.8Ag-0.5Cu无铅钎料熔化特性和润湿性的影响
Effects of Bi on Melting Characteristics and Wettability of Sn-0.8Ag-0.5Cu Lead Free Solder Alloy
万忠华1,2, 卫国强
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作者单位:1.华南理工大学 机械与汽车工程学院,广东 广州 510640;2.广州有色金属研究院 焊接钎料研究所,广东 广州 510651
中文关键字: Sn-0.8Ag-0.5Cu钎料合金; 无铅钎料; 熔化特性; 润湿性能;铋元素
英文关键字:Sn-0.8Ag-0.5Cu solder alloy; lead-free solder; melting characteristics; wettability; Bi element
中文摘要:采用差示扫描量热仪和可焊性测试仪分析了Sn-0.8Ag-0.5Cu-xBi钎料的熔化特性和润湿性。结果表明,向Sn-0.8Ag-0.5Cu低银无铅钎料合金中加入适量Bi元素可显著降低合金的熔化起始温度和改善钎料的润湿性,当Bi质量分数达到3.0%时,熔化起始温度比原合金降低6.8 ℃,当Bi质量分数为2.0%时,最大润湿力达到最大值3.91 mN。因此,添加适量的Bi可以同时达到降低低银钎料熔点和改善其润湿性的效果。
英文摘要:Differential scanning calorimetry (DSC) and solderability analyzer were used to detect the melting characteristics and wettability of Sn-0.8Ag-0.5Cu-xBi low Ag lead-free solder alloys, respectively. The results show that Bi addition could distinctly decrease the melting onset temperature of the alloys, which drops 6.8℃ when the mass fraction of Bi reaches 3.0% compared with the Bi-free alloy. The maximum wetting force of the solder with 2.0% Bi addition reaches 3.91 mN. Consequently, it is possible to lower the melting point and improve the wettability of low Ag solder alloy by the certain addition of Bi.