中厚板低频电磁感应加热温度场数值模拟
Simulation on Temperature Fields in Low Frequency Induced Heating for Medium Plate
邢淑清1, 王 强2, 麻永林1,3, 李慧琴1
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作者单位:(1. 内蒙古科技大学 材料与冶金学院, 内蒙古 包头 014010; 2. 中国铁路物资北京公司, 内蒙古 包头 014010; 3. 东北大学 轧制技术与连轧自动化国家重点实验室, 辽宁 沈阳 110004)
中文关键字:中厚板; 低频; 感应加热; 温度场; 数值模拟
英文关键字:medium plate; low frequency; induced heating; temperature field; numerical simulation
中文摘要:采用有限元法中的电磁-热耦合技术,研究了中厚板感应回火加热中三维温度场的变化规律。结果表明:感应加热工艺参数对中厚板厚度、宽度方向的温差以及加热时间都有明显影响。此外,对于本文研究的单面感应加热情况,上表面温升明显高于下表面是这种单面感应加热的一个明显特点。
英文摘要:The change rule of 3D temperature field in induced heating for medium plate was studied with the heat-electromagnetic coupled method of FEM. The results show that the parameters of induced heating process have much influence on heating time and the differences of temperature along thickness and lateral direction. In addition, the single side induced heating process makes one surface temperature high, compared with the other side.