真空电子器件常用金属焊接用钎焊料
Brazing Material Used for Common Metal Materials in Vacuum Electron Devices
李银娥, 姜 婷, 孙晓亮, 马 光
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作者单位:(西北有色金属研究院,陕西 西安 710016)
中文关键字:钎焊; 钎焊料; 真空电子器件
英文关键字:brazing; brazing material; vacuum electronic devices
中文摘要:真空电子器件是由多种材料(包括金属材料和非金属材料)通过焊接方法连接成为结构复杂的构件,尺寸精度要求高,所用钎焊料种类也较多,常用的钎焊料有银基、金基、铜基、钯基和一些活性钎料等。本文就其常用钎焊料进行了简要介绍。
英文摘要:Vacuum electronic device is a kind of complex structure component with varieties of materials, including metal and non-metal, connected by welding. The requirement of dimensional accuracy is high and the kinds of brazing material are diverse, and the common brazing material is Ag-based, Au-based, Cu-based, Pd-based, some active brazing metal and so on. The common brazing material was briefly introduced.