原子掺杂的TiAlN涂层硬质合金刀具界面结合性能的研究

    Study on Interface Bonding Properties of Atomic Doped TiAlN Coated Carbide Tools

    • 摘要: 基于第一性原理方法,建立了TiAlN/WC理想界面及掺杂不同原子x(x=Al、Cr、Ti、Ta、Co)的界面模型,计算其粘附功和掺杂缺陷形成能。从电荷密度分配及成键角度进一步分析了掺杂Al、Ta原子的电子结构和态密度。结果表明:掺杂Al、Co原子时粘附功均增加,界面结合性能提高;掺杂Ti、Ta和Cr原子时粘附功均降低,界面结合性能下降。其中,掺杂Al原子的界面粘附功最大,界面结合性能最好;掺杂Ta原子的界面粘附功最小,界面结合性能最差。掺杂Al原子的界面结构最易形成,掺杂Co原子的掺杂结构最难形成。掺杂Al、Ta原子的界面均是由金属键、共价键和离子键共同作用的结果。与理想界面化合键相比,掺杂Al原子后电荷重新分布,电荷差分密度较大,界面的化合键均增强;掺杂Ta原子后电荷差分密度小,界面的化合键均减弱。

       

      Abstract: Based on the first principle method, an ideal TiAlN/WC interface and interface models of different atoms xx=Al, Cr, Ti, Ta, Co) were established, the adhesion work and doping defect formation energy were calculated. The electronic structure and density of states of the doped Al and Ta atoms were furtherly analyzed from the viewpoint of charge density distribution and bonding.The results show that after doping of Al and Co atoms, the adhesion work increases and the interface bonding properties improves. When Ti, Ta and Cr atoms are doped, the adhesion work is lowered and the interface bonding properties decreases. Among them, the doped Al atom has the largest interfacial adhesion and the best interface bonding properties,while the doped Ta atom has the least interfacial adhesion and the worst interface bonding properties. The interface structure of the doped Al atom is the most easily formed, and the doping structure doped with Co atom is the most difficult to form. The interface between the Al and Ta atoms is found to be bonded by metal, covalent and ionic bond. Compared with the ideal interface bond, the charge is redistributed after doping the Al atom, the charge differential density is increased and the interface bonds are enhanced. After doping with Ta atoms, the charge differential density is small and the interface bonds are weakened.

       

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