Abstract: Carbon/aluminum composite has become the first choice of heat dissipation materials for electronic packaging due to its advantages of light weight, high thermal conductivity and adjustable coefficient of thermal expansion. The characteristics and applicability of high thermal conductivity carbon reinforced phase（high directional graphite, carbon nanomaterials, carbon fibers, carbon foams, diamond and diamond-like carbon films） were briefly introduced, and the properties and research status of different high thermal conductivity carbon/aluminum composites were analyzed. According to the requirements of the practical application of high thermal conductivity composite materials, the future research and development of carbon/aluminum composites were proposed. The effect mechanisms of the orientation designation and surface modification of reinforcements on the interface and thermal conductivity of the composites were focused on. At the same time, the thermal conductivity and mechanical properties of the materials were also the key to large-scale application.