Sn-3Ag-0.5Cu合金与金属Cu的润湿性研究

Research on Wettability of Sn-3Ag-0.5Cu Alloy on Metal Cu

摘要: 研究了加热温度、保温时间对Sn-3Ag-0.5Cu合金钎料在金属Cu基板上的润湿性和界面反应的影响。结果表明：保温时间为60 min，随加热温度在275～350℃增大，Sn-3Ag-0.5Cu钎料的平衡润湿角从56.0°降至28.1°；该润湿属于反应润湿，在界面形成Cu₃Sn相和Cu₆Sn₅相。随着加热温度的增加、保温时间的延长，Cu元素逐渐向Sn-3Ag-0.5Cu合金中扩散，两相厚度逐渐增加且更加均匀。

Abstract: The effects of heating temperature and holding time on the wettability of Sn-3Ag-0.5Cu solder on Cu substrate and interfacial reaction were studied.The results show that when the holding time is 60 min, with the increase of heating temperature from 275℃ to 350℃, the stable wetting angle of Sn-3Ag-0.5Cu solder drops from 56.0% to 28.1°.It belongs to reaction wetting, Cu₃Sn and Cu₆Sn₅ phases are formed at the interface.With the increase of heating temperature and holding time, Cu element gradually diffuses to Sn-3Ag-0.5Cu alloy, and the thickness of the two phases gradually increases and becomes more uniform.