真空热处理制备微米级多孔铜

Preparation of Micron Porous Copper by Vacuum Heat Treatment

摘要: 对Cu₇₅Zn₂₅、Cu₅₀Zn₅₀和Cu₂₅Zn₇₅合金在450、500和550℃进行真空热处理，制备微米级多孔铜。采用XRD、SEM和EDS对制备的多孔铜进行分析，研究温度和成分对真空热处理后孔形貌的影响。结果表明，真空热处理制备的多孔铜孔径为0.5～8.0μm。温度升高使得孔径逐渐增大；铜锌合金中Zn元素含量增多，越容易形成多孔结构和较大的孔径。

Abstract: Micron porous copper was prepared by vacuum heat treatment of Cu₇₅Zn₂₅,Cu₅₀Zn₅₀and Cu₂₅Zn₇₅alloys at 450℃,500℃and 550℃.XRD,SEM and EDS were used to analyze the prepared porous copper,and the effects of temperature and composition on the pore morphology after vacuum heat treatment were studied.The results show that the pore size of porous copper prepared by vacuum heat treatment is 0.5-8.0μm.The pore diameter increases with the increase of temperature.With the increase of Zn content in Cu-Zn alloy,it is easier to form porous structure and larger pore size.