SiCp/Al复合材料典型缺陷超声检测技术研究

    Research on Ultrasonic Testing of Typical Defects in SiCp/Al Composites

    • 摘要: 与常规变形铝合金材料相比,SiCp/Al复合材料会出现Al偏析、贫SiCp带(Al线)和SiCp团聚3类典型缺陷。采用常规A型脉冲反射法检测时,存在对这3类典型缺陷检出能力低、缺陷定量偏差大的问题。针对此现象,设计了与典型缺陷界面相同的模拟试块调节检测灵敏度,并结合相控阵检测方法对材料进行检测。结果表明,缺陷与被检测材料之间的声阻抗差异,以及超声声束与缺陷的位置关系是影响缺陷检出能力低和缺陷定量偏差大的主要因素。模拟试块调节检测灵敏度和多角度相控阵检测方法相结合的新方法,有效解决了Al偏析、Al线和SiCp团聚缺陷回波低、发现难的问题,同时提高了缺陷定量的精度。

       

      Abstract: Compared with conventional deformed aluminum alloy, SiCp/Al composites have three typical defects, such as Al segregation, poor SiCp band (Al wire) and SiCp agglomeration. The typical defects had low detection ability and large quantitative deviation, when the conventional A-type pulse reflection method was used to detect. In order to solve the problem, the same simulation test block as the typical defect interface was designed to adjust the detection sensitivity, and the phased array detection method was used to detect the materials. The results show that, the difference of acoustic impedance between defect and material being inspected, and the relationship between ultrasonic beam and defect location are the main factors that affect the defects detection ability and quantitative deviation. The new method combines the calibration sensitivity of simulated test block with the scan test method of multi angle control array, which can effectively solve the problems which are difficult to find the defects of Al segregation, Al wire and SiCp agglomerated. And meanwhile, it can improve the accuracy of defects quantification.

       

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