精锡和Sn-Ag-Cu合金氧化过程中的微量Zn富集行为

    Enrichment Behavior of Trace Zn during Oxidation of Refined Tin and Sn-Ag-Cu Alloy

    • 摘要: 采用纯度为99.9%的精锡原料制备Sn-3.0Ag-0.5Cu(SAC305)合金,对微量Zn元素在精锡和Sn-3.0Ag-0.5Cu合金氧化过程中的表面富集行为进行了研究。将精锡与SAC305在300℃条件下分别进行动态氧化试验,结果表明,SAC305的渣率低于精锡。用XPS深度剖析法研究300℃静态条件下氧化后的精锡与SAC305的表面氧化情况。结果表明,氧化后的精锡和SAC305表面Zn元素的浓度是精锡原料中的1000倍以上,且SAC305较精锡表面具有更高的Zn元素浓度和更薄的氧化层厚度。综上,认为精锡原料中微量元素Zn在表面的高度富集会对锡及锡合金的氧化行为产生影响。在制备锡基合金焊料时,原料中的Zn元素应该予以关注。

       

      Abstract: Sn-3.0Ag-0.5Cu (SAC305) alloy was prepared by using refined tin with purity of 99.9%. The surface enrichment behavior of trace Zn in oxidation process of refined tin and Sn-3.0Ag-0.5Cu alloy was studied. The dynamic oxidation tests of refined tin and SAC305 were carried out at 300℃respectively.The results show that the slag percentage of SAC305 is lower than that of refined tin.The surface oxidation of refined tin and SAC305 after static oxidation at 300 ℃was studied by XPS depth analysis. The results show that the concentration of Zn on the surface of oxidized refined tin and SAC305 is more than 1000 times than that of the raw material, and SAC305 has higher concentration of Zn element and thinner oxide layer thickness than the refined tin surface. In conclusion, it is considered that high concentration of trace element Zn on the surface of refined tin material can affect the oxidation behavior of tin and tin alloy. It should be paid attention to Zn in the raw material when preparing tin-based alloy solder.

       

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