TA1钛板表面凹坑激光熔覆修复后的电学性能和镀铜效果研究

    Study on Electrical Properties and Copper Plating Effect of TA1 Titanium Plate Surface Pits Repaired by Laser Cladding

    • 摘要: 采用涡流导电仪、扫描电子显微镜(SEM)和模拟实际生产工况的高电流密度镀铜试验,研究了TA1钛板表面凹坑激光熔覆修复后的电学性能、镀铜铜箔外观质量和微观形貌。结果表明:TA1钛板凹坑缺陷采用激光熔覆工艺修复后,熔覆区、熔合区、热影响区与基材区的导电率略有差异,平均差异均在5%以内,但是各区域镀的铜箔外观质量和微观形貌几乎无差异。采用激光熔覆技术对阴极钛辊表面凹坑等缺陷进行修复,有望实现钛辊的绿色修复再制造。

       

      Abstract: The electrical properties of TA1 titanium plate after laser cladding pits, the surface and microstructure of the plated Cu foil were studied by eddy current conductivity meter, scanning electron microscope(SEM) and high current density copper plating test under simulated actual production conditions. The results show that when the pit defect of TA1titanium plate is repaired by the laser cladding process, the conductivity between cladding area, fusion area, heat affected area and substrate area is slightly different, with an average difference of less than 5%, but the appearance and micromorphology of the copper foil plated on each area are almost the same. Laser cladding technology is used to repair the defects such as the surface pit of the cathode titanium roller, which is expected to realize green repair and remanufacturing of the titanium roller.

       

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