Abstract: In order to study the oxide layer thickness and stress distribution during the interfacial oxidation of thermal barrier coatings, a finite element model of interfacial oxidation chemo-mechanical coupling growth and stress evolution of thermal barrier coatings based on real interface morphology was developed, and the oxide layer growth and stress evolution were simulated. The results show that the thickness of oxide layer at the rough interface is obviously larger than that at the other positions. With the increase of oxidation time, the interface between the oxide layer and the bonding layer gradually tends to be smooth, which is consistent with the reference results. The Y-direction tensile stress in the coatings is mainly located at the peak of the interface between the oxide layer and the bond layer, and at the trough of the interface between the oxide layer and the ceramic layer, which are the dangerous areas of interface oxidation failure of the thermal barrier coatings.