碳化硅陶瓷烧结技术的研究及应用

    Research and Application of Sintering Technologies for SiC Ceramic Materials

    • 摘要: 碳化硅结构中含有强共价键,共价键的键能高达78%,在烧结过程中需要增加一些烧结助剂、外部压力等条件,降低键合强度,使其致密化,以满足碳化硅陶瓷在航空航天、化工、机械等领域的应用。综述了碳化硅陶瓷烧结工艺的研究进展和应用现状,常用烧结工艺有无压烧结、热压烧结、热等静压烧结、反应烧结,最新烧结工艺有微波烧结、闪烧、放电等离子烧结和振荡压力烧结工艺,展望了碳化硅陶瓷未来的研究方向。

       

      Abstract: The structure of silicon carbide contains strong covalent bonds, and the bond energy of covalent bonds is as high as 78%. During the sintering process, some sintering aids, external pressure and other conditions need to be added to reduce the bonding strength and make it densified to meet the requirements of the application of silicon carbide ceramics in aerospace, chemical industry, machinery and other fields. The research progress and the application statu of Si C ceramic sintering process were reviewed. Common sintering include pressureless sintering, hot-pressing sintering, hot isostatic sintering and reactive bonding sintering, and the latest sintering processes are microwave sintering, flash sintering, spark plasma sintering and oscillatory pressure sintering. The future research direction of silicon carbide ceramics was prospected.

       

    /

    返回文章
    返回