磁控溅射工艺对Al箔上沉积Cu2ZnSnS4薄膜的影响

    Effects of Magnetron Sputtering Process on Deposition of Cu2ZnSnS4 Film on Al Foil

    • 摘要: 采用磁控溅射和后硫化法在Al衬底上制备Cu2ZnSnS4(CZTS)薄膜,研究了金属前驱体堆叠结构和溅射时间对Al衬底上沉积的CZTS薄膜质量的影响。X射线衍射(XRD)和拉曼(Raman)光谱表明所有样品均存在锌黄锡矿型CZTS相。扫描电镜(SEM)和X射线能谱分析(EDS)表明所有样品的Al/CZTS界面不存在Al2S3二次相层。电流-电压(I-V)特性曲线表明Al/CZTS界面形成欧姆接触。上述实验结果证明Al作为CZTS膜的衬底和背电极的可行性。此外,通过Raman光谱和EDS证实采用Al/Cu/Zn/Sn/Cu和Al/Zn/Sn/Cu/Zn堆叠结构的样品薄膜表面会存在明显的CuxS二次相,而采用Al/Zn/Sn/Cu堆叠结构的样品没有观察到CuxS二次相。并且,随着溅射时间的成倍增加,样品薄膜变得更平整,CZTS相的结晶性先增强后减弱,Sn2S3二次相减少,CZTS/Al的结构电阻先减少后增大。

       

      Abstract: Cu2ZnSnS4(CZTS) films were prepared on Al substrates by magnetron sputtering and post-sulfurization. The effects of metal precursor stacking structure and sputtering time on the quality of CZTS films deposited on Al substrates were studied. X-ray diffraction(XRD) and Raman spectra show that all samples have a kesterite-type CZTS phase. Scanning electron microscopy(SEM) and X-ray energy dispersive spectroscopy(EDS) shows that there is no Al2S3 phase layer at the Al/CZTS interface of all samples. The current-voltage(I-V) characteristic curve shows that the Al/CZTS interface forms ohmic contact. The above experimental results prove the feasibility of Al as the substrate and back electrode of CZTS film. In addition, Raman spectroscopy and EDS confirm the presence of a significant CuxS secondary phase on the surface of the films for Al/Cu/Zn/Sn/Cu and Al/Zn/Sn/Cu/Zn stacked structures, whereas no CuxS secondary phase is observed for the Al/Zn/Sn/Cu stacked structure. Moreover, with the increase of sputtering time, the sample film becomes smoother, the crystallinity of CZTS phase increases first and then decreases, the secondary phase of Sn2S3 decreases, and the structural resistance of CZTS/Al decreases first and then increases.

       

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