Mg、Sn和Ag的添加对C19210合金带材组织和性能的影响

    Effect of Addition of Mg, Sn and Ag on Microstructure and Properties of C19210 Alloy Strip

    • 摘要: 在C19210中添加Mg和Ag,以及Sn和Ag元素制备不同成分的铸锭,然后依次进行热轧、冷轧和时效,研究了不同成分合金带材在400、450和500℃时效过程中的晶粒组织、力学性能和导电率。结果表明:Mg和Ag的添加或Sn和Ag的添加能阻碍时效过程中的再结晶及再结晶晶粒的长大。在400、450℃时效过程中,添加Mg和Ag,以及Sn和Ag的合金硬度分别保持在140 HV和150 HV左右。不同成分合金在500℃时效均形成完全再结晶晶粒组织,合金硬度随时效时间增加逐渐降低。不同成分合金时效过程中导电率均随时效时间的增加而逐渐升高。添加Mg和Ag,或Sn和Ag元素的合金在500℃时效0.5 h后,导电率能保持在70%IACS左右,同时抗拉强度提高了100 MPa左右。

       

      Abstract: Ingots with different compositions were prepared by adding Mg and Ag, as well as Sn and Ag to C19210, then hot rolling, cold rolling and aging were carried out in sequence, and the grain structure, mechanical properties and conductivity of different alloy strips were studied during aging at 400 ℃, 450 ℃ and 500 ℃. The results show that the addition of Mg and Ag, or Sn and Ag can hinder the recrystallization and growth of the recrystallized grains during aging process. During 400℃ and 450℃ aging process, the hardness of the alloy with Mg and Ag and the alloy with Sn and Ag remain at about 140 HV and 150 HV, respectively. When the alloys are aged at 500℃, the fully recrystallized grain structures are formed for the alloys with different components, and the hardness of the alloy decreases gradually with the increase of aging time. The conductivity of the alloys with different components increases gradually with the increase of aging time. The conductivity of the alloy containing Mg and Ag, or Sn and Ag can be maintained at about 70%IACS after aging at 500℃ for 0.5 h, while the tensile strength is increased by about 100 MPa.

       

    /

    返回文章
    返回