Abstract: The thermal deformation behavior of Cu-3Ti alloy at deformation temperature of 650-800 ℃ and strain rate of 0.01-5 s^-1was investigated by using Gleeble 3800 thermal simulation testing machine. On this basis, according to the Arrhenius hyperbolic sinusoidal equation, the thermal compression deformation constitutive equation of the copper alloy was established. The results show that the rheological stress of Cu-3Ti alloy gradually increases with the deformation rate increasing and decreases with the deformation temperature increasing, and the low strain rate and high deformation temperature are more likely to induce the occurrence of dynamic recrystallization. The constitutive equation was modified according to the effect of strain on the rheological stress, and the simulation results of the rheological stress were in good agreement with the experiment results. Based on the dynamic material model, the thermal processing diagrams were established at the strain of 0.1, 0.3 and 0.5. From the thermal processing diagrams, it can be concluded that the suitable thermal processing process of Cu-3Ti alloy is strain rate of 0.01-0.1 s^-1and temperature of 720-800 ℃.