Abstract: With the upgrading of 5G communication technology and new energy vehicles, higher requirements are put forward for copper foil for circuit boards. After a series of post-treatment processes such as pre-treatment, coarsening, curing,galvanizing and chrome plating for the surface of electrolytic raw foil, the microstructure and properties of copper foil improve, which can meet the application of 5G communication high-end circuit boards. The plating and chromium plating processes were optimized and then the effects of plating parameters（current density, deposition time and bath temperature） on the microstructure and electrochemical properties of zinc barrier layer and chromium passivation layer of copper foil were analyzed. The results show that when the galvanizing current density is 2 A/dm², the deposition time is 16 s and the temperature of the zinc bath is 40 ℃, the microstructure of the galvanizing layer Is dense and the corrosion resistance is the best. When the current density of chromium plating is 1 A/dm², the deposition time is 15 s, and the temperature of chromium plating solution is 30 ℃, the performance of chromium passivation layer is excellent.