Abstract: For the reliability problems of micro-joints in electronic packaging, the application of finite element simulation in the reliability assessment of micro-joints was comprehensively reviewed. The application of finite element simulation in the temperature distribution of micro-joints in electronic packaging was systematically introduced to provide theoretical guidance for solving the heat dissipation problem of electronic packaging devices. The stress-strain response of electronic devices under different loading conditions and the fatigue failure mechanism of micro-joints were reviewed. The fatigue life prediction of micro-joints was systematically analyzed, and the material constitutive models of micro-joints and the fatigue life models were analyzed, the future development trend of reliability of micro-joints research was looked forward, so as to provide theoretical guidance for the research of reliability of micro-joints.