Ce元素对Sn-0.7Cu-0.5Ni钎料合金组织和力学性能的影响

    Effect of Ce Element on Microstructure and Mechanical Properties of Sn-0.7Cu-0.5Ni Solder Alloy

    • 摘要: 制备不同Ce含量(0~0.30wt%)的Sn-0.7Cu-0.5Ni钎料合金,通过铺展试验、拉伸试验及SEM观察研究了微量稀土元素Ce对Sn-0.7Cu-0.5Ni钎料合金在铜板上的焊接性能和接头力学性能的影响。结果表明:添加0.10wt% Ce显著提高钎料在铜母材的铺展,铺展率达到最大,为81.2%,钎料的抗拉强度为44.2 MPa,伸长率为44.8%。添加Ce元素细化了钎料微观组织,但过量Ce形成脆性相,损害性能;适量Ce抑制Cu原子扩散,减缓金属间化合物层生长,提升接头可靠性。本研究为开发高性能稀土钎料提供了依据。

       

      Abstract: Sn-0.7Cu-0.5Ni brazing alloys with varying Ce content (0-0.30wt%) were prepared. The effects of trace rare earth element Ce on the solderability of the Sn-0.7Cu-0.5Ni brazing alloy on copper plate and mechanical properties of the joint were investigated through spreading test, tensile test, and SEM observation. The results show that the addition of 0.10wt% Ce significantly enhances the spreading of the brazing filler metal on the copper base material, achieving a maximum spreading rate of 81.2%. The tensile strength of the brazing filler metal is 44.2 MPa, and its elongation is 44.8%. The addition of Ce element refines the microstructure of the brazing filler metal, but excessive Ce forms brittle phases, which deteriorates the performance. An appropriate amount of Ce inhibits Cu atom diffusion, slows down the growth of the intermetallic compound layer, and enhances joint reliability. This study provides a basis for the development of high-performance rare earth brazing filler metals.

       

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