采用Ti/Cu三明治结构中间层进行YG6X硬质合金活性液相扩散连接研究

    Study on Active Liquid Phase Bonding of YG6X Cemented Carbide Using Ti/Cu Sandwich Structured Interlayer

    • 摘要: 为探索YG6X硬质合金的有效连接方法,本研究设计Ti/Cu叠加三明治结构中间层,采用活性液相扩散连接技术开展Cu/Ti/Cu中间层的YG6X/YG6X同种材料连接试验与Ti/Cu/BNi2中间层的YG6X/45钢异种材料连接试验,并在相同工艺条件下与BiNi2钎料的钎焊工艺进行对比,对接头的剪切强度与微观结构进行了分析。结果表明:Ti/Cu叠加三明治结构中间层均可实现YG6X/YG6X接头与YG6X/45钢接头的活性液相扩散连接,且其剪切强度均高于BiNi2钎焊接头;近共晶成分的Ti/Cu三明治结构中间层可实现对YG6X硬质合金的良好润湿,并有效调节连接应力。Ti元素向YG6X硬质合金基体扩散的距离约为9 μm。中间层Ti/Cu厚度的合理配置是提升接头强度的关键。

       

      Abstract: To explore an effective joining method for YG6X cemented carbide, Ti/Cu laminated sandwich structured interlayers were designed. Active liquid phase bonding technology was employed to conduct joining experiments for the same material YG6X/YG6X with Cu/Ti/Cu as the interlayer and for the dissimilar material YG6X/45 steel with Ti/Cu/BNi2 as the interlayer, and they were compared with the brazing process with the BiNi2 brazing filler metal under the same process conditions. The shear strength and microstructure of the joints were systematically analyzed. The results show that the Ti/Cu laminated sandwich structured interlayer can achieve active liquid-phase diffusion bonding of YG6X/YG6X and YG6X/45 steel joints, and the shear strengths are higher than that of the BiNi2 brazed joints. Ti/Cu sandwich structured interlayer with near-eutectic composition can achieve good wetting of YG6X cemented carbide and effectively adjust the connection stress. The diffusion distance of Ti element into the YG6X cemented carbide matrix is approximately 9 μm. The reasonable configuration of the thickness of the intermediate layer Ti/Cu is the key to enhancing the joint strength.

       

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